Five major development trends in PCB technology

First, along the road of high-density interconnect technology (HDI)

Since HDI concentrates on the advanced technology of contemporary PCBs, it brings fine wire and micro-aperture to the PCB. HDI multi-layer board application terminal electronic products - mobile phone (mobile phone) is a model of HDI frontier development technology. In the mobile phone, the micro-wires of the PCB main board (50μm to 75μm/50μm to 75μm, wire width/pitch) have become mainstream, and the conductive layer and the plate thickness are thinned; the conductive pattern is refined, which brings high density and high performance of electronic equipment. .

For more than 20 years, HDI has promoted the development of mobile phones, and the development of LSI and CSP chips (packages) for packaging and controlling basic frequency functions, and the development of template substrates for packaging have also promoted the development of PCBs. Therefore, it is necessary to follow the road of HDI.

Second, the component embedded technology has a strong vitality

The formation of semiconductor devices (called active components), electronic components (called passive components) or passive component functions in the inner layer of the PCB has been mass-produced. The component embedding technology is a PCB functional integrated circuit. Great changes, but to develop must solve the analog design method, production technology and inspection quality, reliability assurance is a top priority.

We need to invest more resources in systems including design, equipment, testing, and simulation to maintain a strong vitality.

Third, the development of materials in the PCB should be further improved.

Whether it is a rigid PCB or a flexible PCB material, as global electronic products are lead-free, it is required to make these materials more resistant to heat. Therefore, the new high Tg, small thermal expansion coefficient, small dielectric constant, and good dielectric loss tangent are excellent materials. keep appearing.

Fourth, the prospect of photovoltaic PCB is broad

It uses the optical path layer and the circuit layer to transmit signals. The key to this new technology is the fabrication of optical path layers (optical waveguide layers). It is an organic polymer formed by lithographic photolithography, laser ablation, reactive ion etching, and the like. At present, the technology has been industrialized in Japan, the United States, and the like.

Hotline:+86 769-82325116

Consult now
Dongguan Jinglin Communication Technology Co.,Ltd. @ Copyright 2019 all rights reserved [GMAP] [Manage Logins]