In the current era of large-scale commercialization of 5G and accelerated deployment of 6G technology, electronic communication motherboards, as the core carriers for devices such as routers, base stations, 5G modules, and IoT terminals, directly determine the transmission efficiency, stability, and service life of communication equipment through their processing accuracy, signal integrity, and reliability. Dongguan Jinglian Communication Technology Co., Ltd. (hereinafter referred to as "Jinglian Communication") has been deeply involved in the field of electronic communication motherboard processing for many years. Leveraging the advantages of Dongguan's industrial clusters, it focuses on the research, development, and manufacturing of high-frequency, high-speed, and high-density interconnect (HDI) motherboards. With precision craftsmanship, rigorous quality control, and one-stop services, it has become a trusted core supplier for communication equipment enterprises, assisting customers in building high-performance and highly reliable communication terminals and network equipment.

1. Communication mainboard processing core: high-frequency and high-speed substrate + precision craftsmanship, laying a solid foundation for signal transmission

Electronic communication motherboards (PCB/PCBA) differ from ordinary consumer electronics motherboards. Their core requirements include low signal loss, high impedance control, strong anti-interference capability, and wide temperature stability. Especially in 5G/6G communication scenarios, there are stringent requirements for high-frequency signal transmission and high-speed data interaction. Jinglu Communication meets the high standards of the communication industry throughout the entire process, from raw material selection to process implementation, with significant core advantages.

1. Selected high-end base materials to meet high-frequency and high-speed communication needs

Raw materials are the source of motherboard quality. Jinglu Communication's motherboards all utilize high-frequency and high-speed boards with low dielectric constant (Low Dk) and low dielectric loss (Low Df), such as modified FR-4 enhanced type, Rogers series, Panasonic decoupling PT, and Lianmao IT series. These boards effectively reduce signal transmission loss and delay, ensuring the integrity of high-speed signals at 10Gbps and above. The copper foil used is high-purity electrolytic copper foil, with an inner layer of 18μm and an outer layer of 12μm (thinner copper foil can be customized for high-frequency scenarios), balancing conductivity and fine circuit processing requirements. The prepreg precisely matches the board characteristics, ensuring the structural strength and insulation performance of the laminated motherboard. It can withstand extreme temperature changes from -40℃ to 85℃, making it suitable for harsh scenarios such as outdoor base stations and industrial communication.

2. Core processing technology: HDI + fine circuit, achieving high-density interconnection

Under the trend of miniaturization and integration of communication equipment, HDI (High-Density Interconnect) technology has become mainstream in high-end communication motherboards. Jinglu Communication has mastered the core technology of HDI from 1-layer to Any-layer, establishing a three-dimensional wiring network through micro-vias, blind buried vias, and fine lines, breaking through the limitations of traditional through-hole wiring.

Laser drilling technology: Utilizing CO₂/UV lasers to process micro-holes (with a diameter of 40-60μm), it significantly surpasses the 0.15mm limit of mechanical drilling, enabling efficient interlayer connectivity. A typical 5G mobile phone motherboard can integrate over 20,000 laser holes, boosting wiring density by over 40%;

Fine circuit fabrication: Utilizing LDI (Laser Direct Imaging) and msAP (Semi-Additive Process) technology, the minimum line width/line spacing can reach 30μm/30μm, meeting the mounting requirements of high-density packaged components such as BGA and QFP, and adapting to high-end devices such as 5G baseband chips and AI processors;

Precision lamination and impedance control: 8-16 layers of precision laminated structure (with reasonable layout of signal layers, power layers, and ground layers), vacuum press at 180℃+ high temperature and high pressure curing, interlayer alignment accuracy ±25μm; strictly controlling characteristic impedance (50Ω single-ended, 90/100Ω differential), with a tolerance of ±10%, reducing high-speed signal reflection and ensuring transmission stability;

Advanced surface treatment: We offer processes such as electroless nickel-palladium-gold (ENEPIG), silver immersion, and gold immersion. The ENEPIG process can withstand 1000 thermal cycles ranging from 55 to 125℃, ensuring strong solder reliability and meeting the requirements for high-frequency signal transmission and long-term use.

3. SMT chip mounting and PCBA processing: Micron-level precision ensures soldering reliability

Jingluo Communication is equipped with a fully automated high-speed SMT (Surface Mount Technology) production line, utilizing high-precision pick-and-place machines from Japan's Fuji and Yamaha. It can mount ultra-micro components such as 01005 and high-end devices like BGA/QFP with a pitch of 0.2mm, achieving a mounting accuracy of ±25μm. The reflow soldering process employs real-time temperature curve monitoring to ensure uniform melting of the solder, forming strong solder joints. In response to the high-frequency characteristics of communication motherboards, the design of solder pads and steel mesh openings is optimized to reduce the risks of cold solder joint and short circuit. Coupled with AOI (Automatic Optical Inspection) and X-ray inspection, 100% inspection is conducted for mounting defects and internal solder joint issues, ensuring a PCBA (Printed Circuit Board Assembly) processing yield of ≥99.5%.

II. Processing Advantages of Jinglu Communication Motherboards: Smart Manufacturing in Dongguan + Full-chain Services, Efficient Delivery of High-quality Products

1. Dongguan's industrial clusters empower and ensure stable and efficient supply chains

Jingluo Communication is located in Dongguan, the global electronics manufacturing hub. Leveraging the well-established electronics industry chain in the Pearl River Delta, it achieves rapid procurement of raw materials (boards, copper foil, components) and efficient collaboration in outsourced processing, significantly shortening the production cycle. The company boasts a 3000㎡ modern anti-static and dust-free workshop, certified by ISO9001 Quality Management System and ISO14001 Environmental Management System. It adheres to IPC-A-610J CLASS III electronic acceptance standards, ensuring standardized and normalized production processes. With a monthly production capacity of up to 500,000 communication motherboards, the company caters to both small-batch prototyping and large-scale mass production needs.

2. A comprehensive quality control system that rigorously oversees every step of the process

Jingluo Communication adheres to the philosophy of "Quality First, Striving for Excellence" and has established a comprehensive quality control system that spans the entire process from the arrival of raw materials to the shipment of finished products:

Raw material inspection: Each batch of plates, copper foil, and ink undergoes performance testing to prevent unqualified raw materials from entering the warehouse;

Process inspection: For key processes such as inner layer wiring, drilling, lamination, solder mask, SMT, etc., dedicated personnel conduct real-time inspections to promptly identify and address process anomalies;

Full inspection of finished products: flying probe test / needle bed test (100% electrical performance test) + AOI optical inspection + X-ray inspection. For some high-frequency products, additional impedance testing, high and low temperature cycling testing, and damp heat testing are conducted to ensure that the products meet the reliability standards of the communication industry.

3. One-stop customized service, adaptable to diverse communication scenarios

Jingluan Communication not only provides motherboard processing services, but also offers a one-stop solution from design optimization, PCB manufacturing, SMT chip mounting, component procurement, PCBA testing to finished product assembly, adapting to different communication scenarios:

5G/6G base station motherboard: high heat dissipation, high stability, high-frequency signal transmission;

Router/Switch motherboard: high density, multiple interfaces, strong anti-interference;

Internet of Things (IoT) communication module motherboard: miniaturized, low power consumption, high integration;

Industrial communication motherboard: wide temperature range, shock resistance, corrosion resistance, suitable for harsh industrial environments.

The company boasts a professional engineering and technical team that can assist customers in DFM (Design for Manufacturability) optimization, addressing design challenges such as high-speed signal integrity, heat dissipation, and impedance matching. This helps customers shorten their research and development cycles, reduce production costs, and quickly seize the market.

III. Common application scenarios and customer value of communication motherboard processing

1. Core application scenarios

The electronic communication mainboards processed by Jinglan Communication are widely used in 5G/6G base stations, home/enterprise routers, optical network units (ONUs), IoT communication modules, industrial Ethernet switches, in-vehicle communication terminals, security monitoring equipment, and other fields. Its customers include communication equipment manufacturers, IoT enterprises, industrial control vendors, consumer electronics brands, etc. Its products are exported to domestic markets as well as Southeast Asia, Europe, and the United States.

2. Customer core value

High performance: High-frequency and high-speed technology coupled with precise impedance control ensures high-speed and stable transmission for communication equipment, reducing the bit error rate;

High reliability: stringent quality control + wide temperature design, suitable for harsh outdoor and industrial environments, extending equipment service life;

Low cost: Dongguan industrial clusters + large-scale production, optimizing supply chain, reducing processing costs;

Quick delivery: full-process one-stop service + efficient supply chain, with small batch sampling delivered in 3-5 days and large batch production delivered in 7-15 days;

Strong technology: A professional team supports design optimization and process research and development, adapting to the iterative needs of 5G/6G technology.

IV. Choose Jinglu Communication, and let's work together to create a new future for the communication industry

With the continuous deepening of 5G applications and the accelerated implementation of 6G technology, the electronic communication motherboard, as the core hardware, has seen a continuous growth in market demand, while posing higher requirements on processing technology, quality, and delivery efficiency. Dongguan Jinglian Communication Technology Co., Ltd., leveraging years of experience in communication motherboard processing, advanced production equipment, a professional technical team, a rigorous quality control system, and one-stop service capabilities, is based in Dongguan and serves the global market. It is committed to providing customers with high-quality, cost-effective electronic communication motherboard processing solutions.

Whether it's 5G base stations, routers, IoT modules, or industrial communication equipment, Jinglian Communication can precisely meet customer needs, providing comprehensive support from design to mass production. We aim to enhance our customers' product competitiveness and jointly drive the high-quality development of the communication industry.

Contact us: Dongguan Jinglei Communication Technology Co., Ltd. specializes in electronic communication motherboard processing and PCBA one-stop services. Welcome to inquire, visit in person, and discuss cooperation!